92 entry level English-speaking jobs in Delft

Strong statistical analysis and problem‐solving skills Desired Characteristics and Attributes High level

Minimum 7–10 years of experience in ocean freight forwarding or shipping line operations (Senior/Manager level

Write detailed block-level PLL specifications and behavioral/system models (e.g., Verilog-A, MATLAB).

Expert-level C/C++ with modern coding practices, including templates and object-oriented design.

Bridges naturally between "spot the inefficiency" and "ship the code‐level fix" alongside engineering ... If you want a mandate to work at the pattern and policy level — not just respond to incidents — that's

About the role You'll join a growing DevOps team that spans FPGA, embedded systems, and high-level software

Python for testing and data analysis Ability to debug complex hardware systems at board and system level

develop and produce the next generation of integrated transducers and take their performance to the next level

multi-disciplinary engineering concepts, enabling you to carry out credible and sophisticated conversations with PhD-level

You know how to create an environment where engineers can perform at a high level, collaborate effectively

This role demands a high level of technical acumen, excellent communication skills, and a proactive approach

or reviewer providing geotechnical seismic advice, supervise and educate teams with junior and med-level

This field is rapidly growing and will impact society on a global level.

the Customer : Work directly with advanced customers to understand their needs at a deep technical level

The field is rapidly growing and will impact society on a global level.

work in an environment where your ideas are heard, where we learn from each other, perform at a high level

Document SOPs and train technicians on tool operations and wafer level metrology.

Document SOPs and train technicians on tool operations and wafer level metrology.

Consultant Marinas and Waterfronts You will contribute to the successful implementation of various high-level

and panel‑level packaging Photonic‑electronic co‑integration Thermal management and thermo‑mechanical ... integration Chiplet architectures and interconnect technologies 3D integration and hybrid bonding Wafer‑level